IPC J-STD-003:1992
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Solderability Tests for Printed Boards
Association Connecting Electronics Industries , 04/01/1992
Pages: 15
Contains industry-recommended test methods, defect definitions and illustrations for suppliers and users to assess the solderability of printed board surface conductors, lands and plated through-holes. Test methods covered include edge dip, rotary dip, solder float, wave solder and wetting balance.
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