IEC 60068-2-54 Ed. 2.0 b:2006

IEC 60068-2-54:2006 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This second edition cancels and replaces the first edition, published in 1985 and constitutes a technical revision. The major technical changes with regard to the previous edition concern: – the addition of lead free solder alloy (see Clause 7, Materials); – reversal of force-time curves to align with IEC 60068-2-69 (see Figure 2 and Figure B.1); – modification to the test requirement for progress of wetting (see Clause 9).