IEC 60749-34 Ed. 1.0 b:2004
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Semiconductor devices – Mechanical and climatic test methods – Part 34: Power cycling
International Electrotechnical Commission , 03/10/2004
Pages: 21
Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed causing rapid changes of temperature. The power cycling test is complementary to high temperature operating life.
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