IEC 61189-2-720 Ed. 1.0 b:2024
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Test methods for electrical materials, circuit boards and other interconnection structures and assemblies – Part 2-720: Detection of defects in interconnection structures by measurement of capacitance
International Electrotechnical Commission , 03/01/2024
Pages: 26
This part of IEC 61189 provides a method to evaluate specific characteristics of circuit boards by measuring the capacitance between conductor traces and a ground plane and can be used for qualitative comparison of a test specimen to a reference board. This method is not intended for quantitative measurements and for assessment of conformity to a specification.
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