IEC 61189-2-801 Ed. 1.0 b:2023
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 2-801: Thermal conductivity test for base materials
International Electrotechnical Commission , 07/01/2023
Pages: 26
This part of IEC 61189 defines a test method to be followed for thermal performance via carbon
ink heating. The method employs a screened-on pattern of carbon ink used to determine the
thermal performance of a dielectric layer on a metal base plate.
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