IEC 61191-3 Ed. 1.0 b:1998
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Printed board assemblies – Part 3: Sectional specification – Requirements for through-hole mount soldered assemblies
International Electrotechnical Commission , 08/28/1998
Pages: 31
Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).
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