IEC 62769-4 Ed. 3.0 b:2023
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Field Device Integration (FDI) – Part 4: FDI Packages
International Electrotechnical Commission , 04/01/2023
Pages: 186
This part of IEC 62769 specifies the FDI®1 Packages. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure.
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