This International Standard defines the thermal endurance test methods for reliability assessment of flexible opto-electric circuit boards. The purpose of this document is to accommodate the uniform thermal characteristics required by the flexible opto-electric circuit in high temperature environments such as automobiles. In particular, this document specifies a test method to inspect the occurrence of colour exchange, deformation and delamination of flexible opto-electric circuit boards under thermal stress.
IEC 63251 Ed. 1.0 b:2023
$190.00 Original price was: $190.00.$95.00Current price is: $95.00.
Test method for mechanical properties of flexible opto-electric circuit boards under thermal stress
International Electrotechnical Commission , 11/01/2023
Pages: 46
Category: IEC




