IPC 2292:2018
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Design Standard for Printed Electronics on Flexible Substrates
Association Connecting Electronics Industries , 03/01/2018
Pages: 72
IPC 2292 establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible substrates, as pertain to this standard, are materials or devices which have some amount of flexibility or bendability (not rigid) but are not considered to be stretchable (e.g., fabrics, textiles, stretchable polymers, etc.).
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