IPC 2294:2024
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Design Standard for Printed Electronics on Rigid Substrates
Association Connecting Electronics Industries , 06/01/2024
Pages: 52
This standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on rigid substrates. Rigid substrates as applies to this standard are those that are not required to be flexed into a new shape for the purposes of assembly or operation. The rigid substrate can be conductive (e.g., rigid printed board or assembly), semiconductive or nonconductive.
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